扫描手机二维码
开通时间：2015.10.21
最后更新时间：2024.9.19
的个人主页 http://shi.buaa.edu.cn/sufei/zh_CN/index.htm
附件：
An observation and explanation of interior cracking at the interface of solder by electromigration.pdf
上一条： Development of an infrared polarized microscope for evaluation of high gradient stress with a small distribution area on a silicon chip
下一条： Creep behavior of C/SiC composite in hot oxidizing atmosphere and its mechanism[J]. Ceramics International, 2017.
赞
