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苏飞 ( 副教授 ) 赞
的个人主页 http://shi.buaa.edu.cn/sufei/zh_CN/index.htm
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[1] .Microscopic Mechanism of the High-Temperature Strength Behaviour of a C/SiC Composite.[期刊]:Applied Composite Materials
[2] .Inﬂuence of interfacial bonding conditions on the antipenetration performance of ceramic/metal composite targets.[期刊]:Int J Mech Mater Des
[3] .Development of an infrared polarized microscope for evaluation of high gradient stress with a small distribution area on a silicon chip:Review of Scientific Instruments
[4] .An observation and explanation of interior cracking at the interface of solder by electromigration.[期刊]:Microelectronics Reliability
[5] , et al, Wu J, Huang P,Su F.Creep behavior of C/SiC composite in hot oxidizing atmosphere and its mechanism[J]. Ceramics International, 2017.
[6] , et al, Huang P, Pan X,Su F.Influence of Copper Pumping on Integrity and Stress of Through-Silicon Vias[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2016, 6(8): 1221-1225.
[7] ,Xiaoxu Pan, Tianbao Lan,Fei Su.Stress evaluation of through-silicon vias using micro-infrared photoelasticity and finite element analysis. Optics and Lasers in Engineering, Vol.74(11), Pages 87–93, 2015.
[8] , et al, Lan T B, Li W J,Su F.Investigation on Hygro-Thermo-Mechanical Stress of a Plastic Electronic Package. Journal of Mechanics, Vol. 30(06): 625-630, 2014.
[9] , et al, Wang Y, Zhang Z,Su F.Study of Electromigration-induced Stress of Solder. Journal of Electronic Packaging, 2014
[10] ,Su F.Methodology for the Stress Measurement of Ferromagnetic Materials by Using Magneto Acoustic Emission. Experimental Mechanics, Vol.54(8): 1431-1439, 2014.

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