Effect of thermal boundary resistance between the interconnect metal and dielectric interlayer on temperature increase of interconnects in deeply scaled VLSI
          
 
 - DOI码:10.1021/acsami.0c03010
 
 
 
 - 发表刊物:ACS Applied Materials & Interfaces
 
 
 
 
 
 
 
 
 - 论文类型:期刊论文
 
 
 
 
 
 - 文献类型:期刊
 
 - 卷号:12
 
 - 期号:19
 
 - 页面范围:22347-22356
 
 
 
 - 是否译文:否
 
 
 - 发表时间:2020-04-21
 
 - 收录刊物:SCI