Effect of thermal boundary resistance between the interconnect metal and dielectric interlayer on temperature increase of interconnects in deeply scaled VLSI
- DOI码:10.1021/acsami.0c03010
- 发表刊物:ACS Applied Materials & Interfaces
- 论文类型:期刊论文
- 文献类型:期刊
- 卷号:12
- 期号:19
- 页面范围:22347-22356
- 是否译文:否
- 发表时间:2020-04-21
- 收录刊物:SCI