Yin HB, Wang ZH, Jiao Y, Zhang YX, Ma YJ*, Feng X*, “Interfacial competing fracture in peeling of bi-interface film-substrate system,” Journal of the Mechanics and Physics of Solids, 203: 106216, 2025.
Release time:2026-06-05
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- Pre One:Chen SY, Kong ZW, Shi KW, Chen YL, Zhu F, Ma YJ*, “Peeling method for ultrathin chips based on surface-protective force,” International Journal of mechanical Sciences, 302: 110558, 2025.
- Next One:Yin HB, Ma YJ*, Feng X*, “Rate dependent peeling behavior of the viscoelastic film-substrate system,” International Journal of Solids and Structures, 286-287: 112588, 2024.