Effect of thermal boundary resistance between the interconnect metal and dielectric interlayer on temperature increase of interconnects in deeply scaled VLSI
Release time:2025-01-15
Hits:
- DOI number:
- 10.1021/acsami.0c03010
- Journal:
- ACS Applied Materials & Interfaces
- Indexed by:
- Journal paper
- Document Type:
- J
- Volume:
- 12
- Issue:
- 19
- Page Number:
- 22347-22356
- Translation or Not:
- no
- Date of Publication:
- 2020-04-21
- Included Journals:
- SCI