Modification and characterization of interfacial bonding for thermal management of ruthenium interconnects in next-generation very-large-scale integration circuits
Release time:2025-01-15
Hits:
- DOI number:
- 10.1021/acsami.1c20366
- Journal:
- ACS Applied Materials & Interfaces
- Indexed by:
- Journal paper
- Document Type:
- J
- Volume:
- 14
- Issue:
- 5
- Page Number:
- 7392-7404
- Translation or Not:
- no
- Date of Publication:
- 2022-01-31
- Included Journals:
- SCI