2016-Present:Associate Professor at School of Microelectronics, Beihang University, China

2012-2016:    Full-time Researcher at Advanced CMOS Logic Interconnect,   Interuniversity Microelectronics Centre (IMEC), Belgium

2007-2012:    Research  Assistant at Department of Electronic Engineering, KU Leuven, Belgium

        Lianggong Wen received his Ph.D. in Engineering from the KU Leuven, Leuven, Belgium, in 2013. Prior to that, Dr. Wen joined the Department of Electrical Engineering at KU Leuven in 2006 under the supervision of Prof. Robert Puers, IEEE Fellow and President of the European Sensor Conference, led by Prof. Willy Sansen, a world-renowned master of analog circuit design and a professor at KU Leuven.

        During his tenure at IMEC, Dr. Liangkong Wen has led and participated in more than 20 major EU and international research projects, 

and many of his technological achievements have gained the attention and applications of the world's major microelectronics companies,

 including Intel. The “Atomic Layer Deposition Ruthenium-TiN Interface Interconnect Technology” proposed by Dr. Wen is expected to replace the copper

 damascene interconnect technology which has been used in the industry for more than 20 years at the junction of the pilot process below 10nm, 

and has entered the R&D line of major chip companies such as Samsung, Intel, TSMC, etc., which is expected to bring a revolutionary change in the 

interconnect technology of the chip. It is expected to revolutionize the chip interconnect technology. The results have been published in Journal of 

Applied Materials and Interconnects, which has gained wide attention in the industry. Dr. Wen has published more than 30 papers in international journals

 and conferences, including two best paper awards in international conferences.

        His main research interests focus on High-frequency micro-/nano-devices, terahertz devices  and high-sensitivity sensor technologies, including  MEMS sensors, terahertz sensors, and biosensors.