北京航空航天大学主页平台系统李勇--李勇-中文主页-- Cai, Z., Li, Y.*, Xu, Y., Chen, J., Li, X., Ma, G. and Li, D., 2025. Unified constitutive modeling for hot tensile behavior of TC4 alloy with and without diffusion bonding joint. Journal of Materials Research and Technology, 35, pp.451-466.

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Cai, Z., Li, Y.*, Xu, Y., Chen, J., Li, X., Ma, G. and Li, D., 2025. Unified constitutive modeling for hot tensile behavior of TC4 alloy with and without diffusion bonding joint. Journal of Materials Research and Technology, 35, pp.451-466.

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上一条： Zhang, D., Xiao, Y., Li, C., Zhao, T., Du, H. and Li, Y.*, 2025. Achieving high-quality copper alloy to nickel-based superalloy joint by isostatic high-pressure solid-state diffusion bonding. Journal of Materials Processing Technology, 337, p.118747.

下一条： Zhang, W., Li, Y.*, Wang, C. and Du, H., 2025. Quantifying the influence of porosity on the thermophysical properties of diamond/Al-alloy matrix composite utilizing Micro-CT and finite element modeling. Diamond and Related Materials, 152, p.111896.