E-Mail:
Date of Employment:2024-05-30
School/Department:Hangzhou International Innovation Institute
Administrative Position:Associate Professor
Business Address:4095, Research Bldg #1
Gender:Male
Contact Information:chengpen@connect.hku.hk
Status:Employed
Academic Titles:副教授
Alma Mater:The University of Hong Kong
Discipline:Materials Science and Engineering
Electronic Science and Technology
Gender:Male
Alma Mater:The University of Hong Kong
[1]
Journal Reviews：
Advanced Materials
Advanced Science
The Journal of Physical Chemistry
ACS Applied Materials & Interfaces
Nanotechnology
IEEE Transactions on Nanotechnology
IEEE Transactions on Magnetics
Flexible and Printed Electronics