E-Mail:
Date of Employment:2024-05-30
School/Department:Hangzhou International Innovation Institute
Administrative Position:Associate Professor
Business Address:4095, Research Bldg #1
Gender:Male
Contact Information:chengpen@connect.hku.hk
Status:Employed
Academic Titles:副教授
Alma Mater:The University of Hong Kong
Discipline:Materials Science and Engineering
Electronic Science and Technology
Gender:Male
Alma Mater:The University of Hong Kong
DOI number:10.1021/ACS.NANOLETT.3C04391
Journal:Nano Letters
Co-author:Z. Wang, L. Sun, S. Zhang, Y. Ni, S. Qu, L. Yang, W. Xu
First Author:J. Liu#, C. Jiang#, H. Wei#
Indexed by:Journal paper
Volume:24
Page Number:4336–4345
Translation or Not:no
Date of Publication:2024-04-03