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E-Mail:

Date of Employment:2024-05-30

School/Department:Hangzhou International Innovation Institute

Administrative Position:Associate Professor

Business Address:4095, Research Bldg #1

Gender:Male

Contact Information:chengpen@connect.hku.hk

Status:Employed

Academic Titles:副教授

Alma Mater:The University of Hong Kong

Discipline:Materials Science and Engineering
Electronic Science and Technology

Jiang Chengpeng

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Gender:Male

Alma Mater:The University of Hong Kong

Paper

Current position: Home / Paper
“Fully elastomeric fingerprint-shaped electronic skin based on tunable patterned graphene/silver nanocomposites”

Journal:ACS Applied Materials & Interfaces
Co-author:Y. Wang, D. Mei, W. Ding, C. Jiang, Y. Lu
First Author:L. Zhu
Indexed by:Journal paper
Volume:12
Page Number:31725–31737
Translation or Not:no
Date of Publication:2020-06-22