北京航空航天大学主页平台系统 Dayong Hu--Home-- G.Y. Lu, D.Y. Hu. Failure modes and FEM analysis of microelectronic packaging, Key Engineering Materials, 2006, 324-325: 455-458 (SCI收录, Q3区)

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G.Y. Lu, D.Y. Hu. Failure modes and FEM analysis of microelectronic packaging, Key Engineering Materials, 2006, 324-325: 455-458 (SCI收录, Q3区)

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