扫描手机二维码
开通时间:..
最后更新时间:..
的个人主页 http://shi.buaa.edu.cn/hetian/zh_CN/index.htm
上一条: Xiandong Liu, Denghong Xiao, Yingchun Shan, Qiang Pan, Tian He*. Solder joint failure localization of welded joint based on acoustic emission beamforming, Ultrasonics 74 (2017) 221-232.